Synopsys’ Twan Korthorst explains how PDKs will help speed up the photonic IC design course of by providing constructing blocks equivalent to a number of forms of waveguides, passive gadgets like splitters, combiners, and filters, together with energetic gadgets equivalent to part shifters, detectors, semiconductor optical amplifiers, and lasers.
Siemens EDA’s Harry Foster examines IC and ASIC design traits, together with indications of rising design complexity and a rise in tasks engaged on designs lower than 1M gates for smaller sensor chips for IoT and automotive gadgets.
Cadence’s Ben Gu finds that the idea of software-defined autos joins the adoption of electrified powertrains and a shift in the direction of autonomy in offering carmakers the chance to reimagine and redefine all the automotive expertise.
Arm’s Daniel Owens and Avery Design Methods’ Tzi Yang Shao argue that digital platform co-simulation can speed up SoC verification by integrating Quick Fashions, verification IP, and the gadget beneath take a look at.
Renesas’ Sung Kim introduces a server chipset for next-generation DIMM purposes based mostly on Multiplexer Mixed Ranks DIMM know-how that goals to alleviate the bottleneck of reminiscence bandwidth.
Ansys’ Shawn Carpenter and Modelithics’ Chris DeMartino discover that constructing RF filters turns into much more difficult at greater frequencies as a result of it takes nice precision to find out the precise mixture of values and elements wanted to successfully design a filter to operate.
The ESD Alliance’s Bob Smith chats with Prakash Narain of Actual Intent in regards to the development towards early practical verification of chip designs and what’s new in static sign-off.
And atone for the blogs featured within the newest Manufacturing, Packaging & Materials newsletter:
Amkor’s Chiung Lee, Weilung Lu, and Adrian Arcedera study optical sensor packaging standardization for a rising market.
Coventor’s Arnaud Parent explains tips on how to obtain the accuracy of an ordinary Finite Component mannequin inside sensible simulation occasions utilizing compact fashions.
Nova’s Ilya Osherov reveals how combining spectral measurements and interferometry improves metrology.
SEMI’s Ashley Huang stories that renewable vitality and various supplies might be key in lowering chip trade carbon emissions.
Jesse Allen is the Data Heart administrator and a senior editor at Semiconductor Engineering.